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LP2967 数据表(PDF) 15 Page - National Semiconductor (TI) |
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LP2967 数据表(HTML) 15 Page - National Semiconductor (TI) |
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15 / 17 page ![]() Application Hints (Continued) MAXIMUM POWER DISSAIPATION CAPABILITY Each output pin the LP2967 can deliver a current of up to 150mA over the full operating junction temperature range. However, the maximum output current must be derated at higher ambient temperature to ensure the junction tempera- ture does not exceed 125˚C. Under all possible conditions, the junction temperatures must be within the range specified under operating conditions. The LP2967 is available in MSOP-8 package and 8-bump micro SMD. The junction to ambient temperature coefficient ( θ JA) for an MSOP-8 pack- age is 235˚C/W and the 8-bump micro SMD with minimum copper area is 220˚C/W. The total power dissipation of the device is given by: PD=(V IN −VOUT1) IOUT1+(VIN −VOUT2) IOUT2 The maximum power dissipation, PDmax, that the device can tolerate can be calculated by using the formula: PDmax = (T JMAX −TA)/ θ JA where T JMAX is the maximum specified junction temperature (125˚C), and T A is the maximum ambient temperature. www.national.com 15 |
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