IPS031(S)

2

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(1) Limited by junction temperature (pulsed current limited also by internal wiring)

(2) Operations at higher switching frequencies is possible. See Application. Notes.

Recommended Operating Conditions

These values are given for a quick design. For operation outside these conditions, please consult the application notes.

Symbol Parameter

Min.

Max.

Units

Vds (max) Continuous drain to source voltage

—

35

VIH

High level input voltage

4

6

VIL

Low level input voltage

0

0.5

Ids

Continuous drain current

Tamb=85

—

3.1

A

—

2.8

Rin

Recommended resistor in series with IN pin

0.2

5

k

Ω

Tr-in(max) Max recommended rise time for IN signal (see fig. 2)

—

1

µS

Max. frequency in short circuit condition (Vcc = 14V)

0

1

kHz

V

Symbol Parameter

Min.

Typ.

Max. Units Test Conditions

Rth 1

Thermal resistance free air

—

60

—

Rth 2

Thermal resistance junction to case

—

3

—

Rth 1

Thermal resistance with standard footprint

—

80

—

Rth 2

Thermal resistance with 1" square footprint

—

60

—

Rth 3

Thermal resistance junction to case

—

3

—

Thermal Characteristics

TO-220

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to SOURCE lead. (TAmbient = 25

print with 70

µm copper thickness.

Symbol Parameter

Min.

Max.

Units

Test Conditions

Vds

Maximum drain to source voltage

—

47

Vin

Maximum input voltage

-0.3

7

Iin, max

Maximum IN current

-10

+10

mA

—

2.8

TO220 free air

IPS031

—

18

—

2.2

SMD220 Std. footprint

—18

Pd

Maximum power dissipation

(1)

—

2

—

1.56

ESD1

—

4

C=100pF, R=1500

Ω,

ESD2

—

0.5

C=200pF, R=0

Ω, L=10µH

T stor.

Max. storage temperature

-55

150

Tj max.

Max. junction temperature

-40

+150

Tlead

Lead temperature (soldering, 10 seconds)

—

300

V

W

A

kV