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SFH4543 数据表(PDF) 6 Page - OSRAM GmbH |
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SFH4543 数据表(HTML) 6 Page - OSRAM GmbH |
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6 / 10 page  2016-04-14 6 Version 1.2 SFH 4543 Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm (inch). OHF02450 5.9 (0.232) 7 (0.276) Cu-Fläche > 20 mm Cu-area > 20 mm 2 Paddesign for verbesserte Wärmeableitung improved heat dissipation Padgeometrie für Lötstopplack Solder resist Component Location on Pad Bauteil positioniert Aussparung 4.85 (0.191) 5.2 (0.205) Lötpad (1 (0.039)) 1.5 (0.059) 2 ±0.05 (0.002) |
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