Iss1 C1u,

Date 13-7-2011

Stability Characteristics

Test item

Condition of test

1

Mechanical shock

(a) Drops: 3 times on concrete floor

(b) Height: 1.0 m

2

Vibration resistance

(a) Frequency of vibration: 10~55Hz

(b) Amplitude: 1.5 mm

(c) Directions: X,Y and Z

(d) Duration: 2 hours

3

Moisture resistance

(a) Condition: 40°C, 90~95% R.H.

(b) Duration: 96 hours

(c) Wait 4 hours before measurement

4

Climatic sequence

(a) +70°C for 16 hours

(b) +55°C for 24 hours, 90~95% R.H.

(c) -25°C for 2 hours

(d) +40°C for 24 hours, 90~95% R.H.

(e) Wait 4 hours before measurement

(a) Temperature: 70°C

(b) Duration: 250 hours

5

High temperature exposure

(c) Wait 4 hours before measurement

(a) +70°C for 30 minutes

 -25°C for 30 minutes repeated 3 times

(b) Wait 4 hours before measurement

6

Thermal impact

Requirements:

The SAW filer shall remain within the electrical specifications after tests.

Remarks



SAW devices should not be used in any type of fluid such as water, oil, organic solvent, etc.



Be certain not to apply voltage exceeding the rated voltage of components.



Do not operate outside the recommended operating temperature range of components.



Sudden change of temperature shall be avoided, deterioration of the characteristics can occur.



Be careful of soldering temperature and duration of components when soldering.



Do not place soldering iron on the body of components.



Be careful not to subject the terminals or leads of components to excessive force.



SAW devices are electrostatic sensitive. Please avoid static voltage during operation and storage.



Ultrasonic cleaning shall be avoided. Ultrasonic vibration may cause destruction of components.

Recommended Soldering Profile

1.

The specifications of this device are subject to change or obsolescence without notice.

2.

Typically, equipment utilizing this device requires emissions testing and government approval, which is the responsibility

of the equipment manufacturer.

3.

Our liability is only assumed for the Surface Acoustic Wave (SAW) component(s) per se, not for applications, processes

and circuits implemented within components or assemblies.

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