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ADL5721ACPZN-R7 数据表(PDF) 6 Page - Analog Devices |
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ADL5721ACPZN-R7 数据表(HTML) 6 Page - Analog Devices |
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6 / 16 page ![]() Data Sheet ADL5721 Rev. 0 | Page 5 of 15 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND INPT RBIAS VCC1 OUTN NOTES 1. THE EXPOSED PAD MUST BE SOLDERED TO A LOW IMPEDANCE GROUND PLANE. 2. THE DEVICE NUMBER ON THE FIGURE DOES NOT INDICATE THE LABEL ON THE PACKAGE. REFER TO THE PIN 1 INDICATOR FOR THE PIN LOCATIONS. OUTP BAND VCC2 3 4 1 2 6 5 8 7 ADL5721 TOP VIEW (Not to Scale) Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1 VCC1 1.8 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. 2 GND Ground. 3 INPT RF Input. This pin is a 50 Ω single-ended input. 4 RBIAS Resistor Bias. For typical operation, connect a 442 Ω resistor from RBIAS to GND. It is recommended to place the RBIAS resistor as close to the pin as possible. 5 BAND Band Select Control. Select a logic low of 0 V for the lower frequency range from 5.9 GHz to 7.2 GHz. Select a logic high of 1.8 V for the higher frequency range from 7.1 GHz to 8.5 GHz. 6, 7 OUTP, OUTN RF Outputs. These pins are 100 Ω differential outputs. 8 VCC2 3.3 V Power Supply. It is recommended to place the decoupling capacitors as close to this pin as possible. EPAD (EP) Exposed Pad. The exposed pad must be soldered to a low impedance ground plane. |
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