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AD8222BCPZ-R7 数据表(PDF) 17 Page - Analog Devices |
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AD8222BCPZ-R7 数据表(HTML) 17 Page - Analog Devices |
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17 / 25 page ![]() AD8222 Data Sheet Rev. B | Page 16 of 24 REFERENCE TERMINAL The output voltage of an AD8222 channel is developed with respect to the potential on the corresponding reference terminal. Typically, the reference terminal is connected to ground, but it can also be driven with a voltage to offset the output signal. For example, connect a voltage to the reference terminal to level- shift the output so that the AD8222 can drive a single-supply ADC. Both REF1 and REF2 are protected with ESD diodes and should not exceed either +VS or −VS by more than 0.3 V. For best performance, source impedance to a reference terminal should be kept below 1 Ω. As shown in Figure 45, the reference terminal is at one end of a 10 kΩ resistor. Additional impedance at the reference terminal adds to this 10 kΩ resistor and results in amplification of the signal connected to the positive input. The amplification from the additional RREF can be computed by REF REF R R kΩ 20 kΩ 10 2 Only the positive signal path is amplified; the negative path is unaffected. This uneven amplification degrades the CMRR of the amplifier. INCORRECT AD8222 V CORRECT AD8222 OP2177 + – V CORRECT AD8222 AD8222 + – V REF REF REF Figure 46. Driving the Reference Pin PACKAGE CONSIDERATIONS The AD8222 comes in a 4 mm × 4 mm LFCSP. Beware of blindly copying the footprint from another 4 mm × 4 mm LFCSP device; the landing pattern may be different. Refer to the Outline Dimensions section to verify that the PCB symbol has the correct dimensions. The AD8222 comes in two package varieties, both with and without a thermal pad. Package Without Thermal Pad The AD8222 ships with a package that does not include a thermal pad; it is the preferred package for the AD8222. Unlike chip scale packages where the pad limits routing capability, the AD8222 package allows routes and vias directly underneath the chip, so that the full space savings of the small LFCSP can be realized. Although the package has no metal in the center of the device, the manufacturing process does leave a very small section of exposed metal at each of the package corners, shown in Figure 56 in the Outline Dimensions section. This metal is connected to −VS through the device. Because of a possibility of a short, vias should not be placed underneath this exposed metal. Package with Thermal Pad This package is included primarily for legacy reasons. Because the AD8222 dissipates so little power, there is little need for the thermal pad. The thermal pad is connected internally to −VS. The pad can either be left unsoldered, soldered to an otherwise unconnected PCB landing, or soldered to a landing connected to the negative supply rail (−VS). If pin compatibility with the AD8224 is desired, the pad should not be electrically connected to any net, including −VS. The solder process can leave flux and other contaminants on the board. When these contaminants are between the AD8222 leads and thermal pad, they can create leakage paths that are larger than the bias currents of the AD8222. A thorough washing process removes these contaminants and restores the excellent bias current performance of the AD8222. LAYOUT The AD8222 is a high precision device. To ensure optimum performance at the PC board level, take care in the design of the board layout. The AD8222 pinout is arranged in a logical manner to aid in this task. Common-Mode Rejection Over Frequency The AD8222 has a higher CMRR over frequency than typical in-amps, which gives it greater immunity to disturbances, such as line noise and its associated harmonics. A well-implemented layout is required to maintain this high performance. Input source impedances should be matched closely. Source resistance should be placed close to the inputs so that it interacts with as little parasitic capacitance as possible. Parasitics at the RGx pins can also affect CMRR over frequency. The PCB should be laid out so that the parasitic capacitances at each pin match. Traces from the gain setting resistor to the RGx pins should be kept short to minimize parasitic inductance. Reference Errors introduced at the reference terminal feed directly to the output. Take care to tie REF to the appropriate local ground. Power Supplies Use a stable dc voltage to power the instrumentation amplifier. Noise on the supply pins can adversely affect performance. The AD8222 has two positive supply pins (Pin 5 and Pin 16) and two negative supply pins (Pin 8 and Pin 13). Although the device functions with only one pin from each supply pair connected, both pins should be connected for specified performance and optimum reliability. |
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