AD8224HBCPZ-R7 datasheet(10/29 Pages) AD

10 / 29 page

Data Sheet

AD8224

Rev. D | Page 9 of 28

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter

Rating

Supply Voltage

±18 V

Power Dissipation

See Figure 2

Output Short-Circuit Current

Indefinite1

Input Voltage (Common Mode)

±V

Differential Input Voltage

±V

Storage Temperature Range

−65°C to +130°C

Operating Temperature Range2

−40°C to +125°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

130°C

Package Glass Transition Temperature

130°C

ESD (Human Body Model)

4 kV

ESD (Charge Device Model)

1 kV

ESD (Machine Model)

0.4 kV

1 Assumes the load is referenced to midsupply.

2 Temperature for specified performance is −40°C to +85°C. For performance

to 125°C, see the Typical Performance Characteristics section.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 9.

Exposed Pad Package

Unit

CP-16-26: LFCSP, EPAD Soldered to Board

°C/W

CP-16-26: LFCSP, EPAD Not Soldered to Board

°C/W

Table 10.

Hidden Paddle Package

Unit

CP-16-19: LFCSP

°C/W

The θJA values in Table 9 and Table 10 assume a 4-layer JEDEC

standard board. If the thermal pad is soldered to the board, it is

also assumed it is connected to a plane. θJC at the exposed pad is

4.4°C/W.

Maximum Power Dissipation

The maximum safe power dissipation for the AD8224 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 130°C, which is the glass transition temperature,

the plastic changes its properties. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the amplifiers. Exceeding a temperature of 130°C for an

extended period can result in a loss of functionality. Figure 2

shows the maximum safe power dissipation in the package vs.

the ambient temperature for the LFCSP on a 4-layer JEDEC

standard board.

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

–60

–40

–20

100

120

140

AMBIENT TEMPERATURE (°C)

θJA = 48°C/W WHEN THERMAL PAD

IS SOLDERED TO BOARD

θJA = 86°C/W WHEN THERMAL PAD

IS NOT SOLDERED TO BOARD

Figure 2. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION

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