Data Sheet

AD8231

Rev. C | Page 23 of 24

OUTLINE DIMENSIONS

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.70

0.60

0.50

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.25

2.10 SQ

1.95

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 57. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-23)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

AD8231ACPZ-R7

−40°C to +125°C

16-Lead LFCSP_WQ, 7”Tape and Reel

CP-16-23

AD8231ACPZ-RL

−40°C to +125°C

16-Lead LFCSP_WQ, 13”Tape and Reel

CP-16-23

AD8231ACPZ-WP

−40°C to +125°C

16-Lead LFCSP_WQ, Waffle Pack

CP-16-23

AD8231WACPZ-RL

−40°C to +125°C

16-Lead LFCSP_WQ, 13”Tape and Reel

CP-16-23

AD8231-EVALZ

Evaluation Board

AUTOMOTIVE PRODUCTS

The AD8231W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices, Inc. account representative for specific product ordering information and

to obtain the specific Automotive Reliability reports for these models.