ADA4960-1

Rev. 0 | Page 6 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage, VCC

5.25 V

VIP, VIN

VCC + 0.5 V

Internal Power Dissipation

See Figure 3

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

to a high thermal conductivity, 4-layer circuit board, as described

in EIA/JESD 51-7.

Table 3. Thermal Resistance

Package Type

Unit

16-Lead LFCSP (Exposed Pad)

89.5

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the ADA4960-1 package

the die. At approximately 150°C, which is the glass transition

temperature, the plastic changes its properties. Even temporarily

exceeding this temperature limit can change the stresses that the

package exerts on the die, permanently shifting the parametric

performance of the ADA4960-1. Exceeding a junction temperature

of 150°C for an extended period can result in changes in the

silicon devices, potentially causing failure.

quiescent power dissipation and the power dissipated in the

package due to the load drive. The quiescent power is the voltage

The power dissipated due to the load drive depends upon the

particular application. The power due to load drive is calculated

by multiplying the load current by the associated voltage drop

across the device. RMS voltages and currents must be used in

these calculations.

addition, more metal directly in contact with the package leads/

exposed pad from metal traces, through holes, ground, and power

Figure 3 shows the maximum safe power dissipation of the

ADA4960-1 vs. the ambient temperature on a JEDEC standard

4-layer board.

2.5

2.0

1.5

1.0

0.5

0

–40

–20

0

20

40

60

80

100

AMBIENT TEMPERATURE (°C)

QUIESCENT POWER

Figure 3. Maximum Power Dissipation vs. Ambient Temperature for 4-Layer Board

ESD CAUTION