ADA4312-1

Data Sheet

Rev. 0 | Page 12 of 12

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-WGGC-3.

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.50

0.40

0.30

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.40

2.35 SQ

2.30

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS SECTION

AND THE THERMAL MANAGEMENT

SECTION OF THIS DATA SHEET.

Figure 21. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-20)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADA4312-1ACPZ-R2

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

ADA4312-1ACPZ-R7

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

ADA4312-1ACPZ-RL

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-16-20

EVAL-ADA4312-1ACPZ

Evaluation Board

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D11044-0-10/12(0)