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ACTF2068 数据表(PDF) 2 Page - Advanced Crystal Technology |
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ACTF2068 数据表(HTML) 2 Page - Advanced Crystal Technology |
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2 / 2 page ![]() Iss1 C1u, Date 13-7-2011 5. Performance 5-1. Maximum Ratings Rating Value Unit Source Power (s. imp. 50Ω, duty cycle 1:100) PS 20 dBm Source Power (source impedance 50Ω) PS 10 dBm DC Voltage VDC 0 V Storage Temperature Range Tstg -40 to +85 °C Operating Temperature Range TA -40 to +85 °C 5-2. Electronic Characteristics Characteristic Minimum Typical Maximum Unit Center Frequency fC -- 140.00 -- MHz Insertion Loss (@140.00MHz) IL -- -- 13 dB 3dB Bandwidth BW3 18 -- -- MHz Amplitude Ripple Δα 132.00 …. 148.00 MHz -- 0.5 0.9 dB Phase Ripple (p-p) Δ φ 132.00…. 148.00 MHz -- 7 14 ° Relative Attenuation (relative to IL) αrel 102.50 …. 112.50 MHz 180.18 …. 195.18 MHz 46 50 56 60 -- -- dB dB Group Delay at fC (@25 ) τC 1.18 1.23 1.30 μs Group Delay Ripple (p-p) Δ τ 132.00 …. 148.00 MHz -- 80 140 ns Temperature Coefficient of Frequency TCf -- -87 -- ppm/K CAUTION: Electrostatic Sensitive Device. Observe precautions for handling! 1. The frequency fC is defined as the midpoint between the 3dB frequencies. 2. Unless noted otherwise, all measurements are made with the filter installed in the specified test fixture that is connected to a 50Ω test system with VSWR≤1.2:1. The test fixture L and C are adjusted for minimum insertion loss at the filter center frequency, fC. Note that insertion loss, bandwidth, and passband shape are dependent on the impedance matching component values and quality. 3. Unless noted otherwise, specifications apply over the entire specified operating temperature range. 4. The specifications of this device are based on the test circuit shown above and subject to change or obsolescence without notice. 5. All equipment designs utilizing this product must be approved by the appropriate government agency prior to manufacture or sale. 6. Our liability is only assumed for the Surface Acoustic Wave (SAW) component(s) per se, not for applications, processes and circuits implemented within components or assemblies. Page 2 of 2 |
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