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MAX1931 数据表(PDF) 7 Page - Maxim Integrated Products |
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MAX1931 数据表(HTML) 7 Page - Maxim Integrated Products |
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7 / 8 page ![]() Current-Limited Switch for Single USB Port _______________________________________________________________________________________ 7 spurious FAULT output. Load-transient faults less than 10ms (typ) do not cause a FAULT output assertion. Only current-limit faults are blanked. Die overtempera- ture faults and input voltage droops below the UVLO threshold cause an immediate fault output. Applications Information Input Capacitor To limit the input voltage drop during momentary output short-circuit conditions, connect a capacitor from IN to GND. A 1µF ceramic capacitor is adequate for most applications; however, higher capacitor values further reduce the voltage drop at the input (see Figure 2). Output Capacitor Connect a 0.1µF capacitor from OUT to GND. This cap- acitor helps prevent inductive parasitics from pulling OUT negative during turn-off. Layout and Thermal Dissipation To optimize the switch-response time to output short- circuit conditions, it is very important to keep all traces as short as possible to reduce the effect of undesirable parasitic inductance. Place input and output capacitors as close to the device as possible (no more than 5mm). All IN and all OUT pins must be connected with short traces to the power bus. Wide power bus planes pro- vide superior heat dissipation through the switch IN and OUT pins. Figure 3 shows suggested pin connections for a single-layer board. Under normal operating conditions, the package can dissipate and channel heat away. Calculate the maxi- mum power dissipation as follows: P = (ILIMIT)2 ✕ RON where ILIMIT is the preset current limit (1.1A max) and RON is the on-resistance of the switch (150m Ω max). When the output is short-circuited, foldback-current-lim- iting activates and the voltage drop across the switch equals the input supply. The power dissipated across the switch increases, as does the die temperature. If the fault condition is not removed, the thermal-overload pro- tection circuitry activates (see the Thermal Shutdown section). Wide power-bus planes connected to IN and OUT and a ground plane in contact with the device help dissipate additional heat. 1 2 3 4 5 10 9 8 7 6 OUT IN OUT FAULT OUT IN OUT IN MAX1931 GND ON Figure 3. IN and OUT Cross Connections for a Single-Layer Board Figure 2. Typical Application Circuit Chip Information TRANSISTOR COUNT: 715 MAX1931 IN OUTPUT OUT INPUT 2.7V TO 5.5V FAULT ON ON OFF 100k Ω 1 µF 0.1 µF* *USB SPECIFICATIONS REQUIRE A LARGER CAPACITOR GND |
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