AD8390A

Data Sheet

Rev. C | Page 12 of 12

OUTLINE DIMENSIONS

4.10

4.00 SQ

3.90

0.35

0.30

0.25

2.25

2.10 SQ

1.95

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

0.70

0.60

0.50

SEATING

PLANE

0.05 MAX

0.02 NOM

0.203 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDIC ATOR AREA OPTIONS

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

EXPOSED

PAD

Figure 18. 16-Lead Lead Frame Chip Scale Package [LFCSP]

4 mm × 4 mm Body and 0.75 mm Package Height

(CP-16-23)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

AD8390AACPZ-R2

−40°C to +85°C

16-Lead LFCSP, 250 Piece Reel

CP-16-23

AD8390AACPZ-RL

−40°C to +85°C

16-Lead LFCSP, 13”Tape and Reel

CP-16-23

AD8390AACPZ-R7

−40°C to +85°C

16-Lead LFCSP, 7”Tape and Reel

CP-16-23

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registered trademarks are the property of their respective owners.

D07094-0-5/16(C)