Data Sheet

ADA4004-1/ADA4004-2/ADA4004-4

Rev. H | Page 13 of 16

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 42. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGC.

1

0.65

BSC

BOTTOM VIEW

TOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

0.70

0.60

0.50

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.35

0.30

0.25

2.25

2.10 SQ

1.95

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 43. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

4 mm × 4 mm Body, Very Very Thin Quad

(CP-16-23)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AB

14

8

7

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

8.75 (0.3445)

8.55 (0.3366)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COPLANARITY

0.10

8°

0°

45°

Figure 44. 14-Lead Standard Small Outline Package [SOIC_N]

Narrow Body

(R-14)

Dimensions shown in millimeters and (inches)