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ADM7170ACPZ-4.2-R7 数据表(PDF) 22 Page - Analog Devices |
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ADM7170ACPZ-4.2-R7 数据表(HTML) 22 Page - Analog Devices |
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22 / 24 page ![]() Data Sheet ADM7170 Rev. C | Page 21 of 23 Figure 64. LFCSP, TA = 50°C Figure 65. LFCSP, TA = 85°C In the case where the board temperature is known, use the thermal characterization parameter, ΨJB, to estimate the junction temperature rise. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and power dissipation (PD) using the following formula: TJ = TB + (PD × ΨJB) (5) Figure 66. LFCSP Power Dissipation for Various Board Temperatures TYPICAL APPLICATIONS CIRCUITS Figure 67. Clock Driver Figure 68. RF PLL/VCO Power TOTAL POWER DISSIPATION (W) 1.8 2.0 2.2 2.4 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 50 60 70 80 90 100 110 120 140 160 130 150 6400mm2 500mm2 25mm2 TJ MAX TOTAL POWER DISSIPATION (W) 1.5 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 65 75 85 95 105 115 125 135 155 145 6400mm2 500mm2 25mm2 TJ MAX TOTAL POWER DISSIPATION (W) 9 8 7 6 5 4 3 2 1 0 0 160 140 120 100 80 60 40 20 TB = 25°C TB = 50°C TB = 65°C TB = 85°C TJ MAX ADM7170 6.5V, 500mA LDO 4V TO 6.5V 3.3V HIGH SPEED CLOCK DRIVER ADM7170 6.5V, 500mA LDO 4V TO 6.5V 3.3V VVCO ADM7170 6.5V, 500mA LDO 3.3V AVDD DVDD ADF4350 |
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