ADUCM350 datasheet(39/41 Pages) AD

39 / 41 page

ADuCM350

Data Sheet

Rev. A | Page 38 of 40

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 45. 120-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-120-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADuCM350BBCZ

−40°C to +85°C

120-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-120-3

ADuCM350BBCZ-RL

−40°C to +85°C

120-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-120-3

1 Z = RoHS Compliant Part.

*COMPLIANT TO JEDEC STANDARDS MO-275-CCCE-1 WITH

EXCEPTION TO PACKAGE HEIGHT.

0.35

0.30

0.25

1.08

1.01

0.94

0.50

0.50 REF

642

BOTTOM VIEW

7.00

BSC SQ

DETAIL A

TOP VIEW

DETAIL A

COPLANARITY

0.08

BALL DIAMETER

SEATING

PLANE

A1 BALL

CORNER

A1 BALL

CORNER

8.10

8.00 SQ

7.90

0.22 NOM

0.17 MIN

*1.35

1.23

1.14

ADUCM350 数据表(PDF) 39 Page - Analog Devices

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