NHQMM datasheet(8/16 Pages) AMPHENOL

8 / 16 page

NTCThermistors

Glass-encapsulated suface mount chips

DKM

MELF

ü ü

• Tmax250°C

• Suitableforharsh

environments and

soldering profiles

SMDcircuitry

Bare bead thermistor

BB05/07/11

ü ü

• Fasttimeconstant,

0.11 secs

•Extremelysmallsize

0.13 to 0.25 mm

• Highstability

RF&microwave

power

measurements

Glass-coated beads

B05/07/10/14

B35/43

ü ü

• Hermeticallysealed

• Smallsize,0.13mm

to 1.1 mm

• Tmax300°C

Gas

chromatography,

thermal

conductivity

analysis, gas flow

measurement,

liquid level sensing

Glass-encapsulated beads, rods, probes

BR11/14/16/23

BR32/42/55

P20/25/30

P60/65/85/100

R60/65/85/100

SP60/65/85/100

FP07/10/14

ü ü ü

• Robust

• Hermeticallysealed

• Tmax300°C

• Interchangeable

matched pairs

available

• Somemodels

with intermittent

operation to 600°C

Liquidlevel

sensing, gas flow

measurement, fluid

temperature, pulse

suppression

Glass encapsulated chips with leads

GC32

GC14/16

GC11

ü ü ü

• Long-termstability

• Chiptechnology

• Size

• Response

• Accuracy

Medical catheters

military/aerospace,

airflow, blood

analysis

Leadless chip thermistors

NDU

ü ü

• Silverorgold

electrodes suitable

for wire bonding

• Smallsize

Hybridcircuits,

glucose

monitors, digital

thermometers

Description

Codes

Key Features

Typical Uses

NHQMM 数据表(PDF) 8 Page - Amphenol Corporation

NHQMM 数据表(HTML) 8 Page - Amphenol Corporation

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