For RLSLB: Remote HIGH Setpoint Low Byte temperature data. Power up default is 0˚C. 1LSB = 0.125˚C. Two’s complement

format.

2.8 REMOTE TEMPERATURE OFFSET REGISTERS (RTOHB and RTOLB)

(Read/Write Address 11h):

BIT

D7

D6

D5

D4

D3

D2

D1

D0

Value

SIGN

64

32

16

8

4

2

1

For RTOHB: Remote Temperature Offset High Byte. Power up default is LHIGH = RHIGH = 0˚C. 1LSB = 1˚C. Two’s complement

format.

(Read/Write Address 12h):

BIT

D7

D6

D5

D4

D3

D2

D1

D0

Value

0.5

0.25

0.125

0000

0

For RTOLB: Remote Temperature Offset High Byte. Power up default is 0˚C. 1LSB = 0.125˚C. Two’s complement format.

The offset value written to these registers will automatically be added to or subtracted from the remote temperature measurement

that will be reported in the Remote Temperature registers.

2.9 LOCAL and REMOTE T_CRIT REGISTERS (RCS and LCS)

(Read/Write Address 20h, 19h):

BIT

D7

D6

D5

D4

D3

D2

D1

D0

Value

SIGN

64

32

16

8

4

2

1

D7–D0: T_CRIT setpoint temperature data. Power up default is T_CRIT = 85˚C. 1 LSB = 1˚C, two’s complement format.

2.10 T_CRIT HYSTERESIS REGISTER (TH)

(Read and Write Address 21h):

BIT

D7

D6

D5

D4

D3

D2

D1

D0

Value

16

842

1

D7–D0: T_CRIT Hysteresis temperature. Power up default is TH = 10˚C. 1 LSB = 1˚C, maximum value = 31.

2.11 FILTER and ALERT CONFIGURE REGISTER

(Read and Write Address BFh):

BIT

D7

D6

D5

D4

D3

D2

D1

D0

Value

00000

Filter Level

ALERT

Configure

D7-D3: is not defined defaults to "0".

D2-D1: input filter setting as defined the table below:

D2

D1

Filter Level

0

0

No Filter

0

1

Level 1

1

0

Level 1

1

1

Level 2

Level 2 sets maximum filtering.

D0: when set to "1" comparator mode is enabled.

2.12 MANUFACTURERS ID REGISTER

(Read Address FEh) Default value 01h.

2.13 DIE REVISION CODE REGISTER

(Read Address FFh) Default value 11hexadecimal or 17 decimal. This register will increment by 1 every time there is a revision

to the die by National Semiconductor.

3.0 Application Hints

The LM86 can be applied easily in the same way as other

integrated-circuit temperature sensors, and its remote diode

sensing capability allows it to be used in new ways as well.

It can be soldered to a printed circuit board, and because the

path of best thermal conductivity is between the die and the

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