BTM510/511 Multimedia Module

Datasheet

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www.lairdtech.com/ramp

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7.3

Reflow Parameters

Laird surface mount modules are designed to be easily manufactured including reflow soldering to a PCB. It is

the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures

during reflow meet the requirements of the solder paste. Laird’s surface mount modules conform to J-STD-

020D1 standards for reflow temperatures.

Important: During reflow, modules should not be above 260° and not for more than 30 seconds.

Figure 6: Recommended reflow temperature

Temperatures should not exceed the minimums or maximums presented in Table 7-1: Recommended maximum

and minimum temperatures.

Table 7-1: Recommended maximum and minimum temperatures

Specification

Value

Unit

Temperature Inc./Dec. Rate (max)

3

°C / Sec

Temperature Decrease rate (goal)

2-3

°C / Sec

Soak Temp Increase rate (goal)

.5 - 1

°C / Sec

Flux Soak Period (min)

60

Sec

Flux Soak Period (max)

90

Sec

Flux Soak Temp (min)

150

°C

Flux Soak Temp (max)

190

°C

Time Above Liquidous (max)

60

Sec

Time Above Liquidous (min)

20

Sec

Time In Target Reflow Range (goal)

30

Sec

Time At Absolute Peak (max)

30

Sec

Liquidous Temperature (SAC305)

217

°C

Lower Target Reflow Temperature

225

°C

Upper Target Reflow Temperature

250

°C

Absolute Peak Temperature

260

°C

Target Profile

Soak Min

Soak Max

Liquidous

Lower Target

Upper Target

Absolute Peak