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ICS341 数据表(PDF) 2 Page - Integrated Circuit Systems |
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ICS341 数据表(HTML) 2 Page - Integrated Circuit Systems |
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2 / 7 page ![]() Field Programmable SS VersaClock Synthesizer MDS 341 E 2 Revision 090704 Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126 ● tel (408) 297-1201 ● www.icst.com ICS341 Pin Assignment 8-pin (150 mil) SOIC Output Clock Selection Table Pin Descriptions External Components Series Termination Resistor Clock output traces over one inch should use series termination. To series terminate a 50 Ω trace (a commonly used trace impedance), place a 33 Ω resistor in series with the clock line, as close to the clock output pin as possible. The nominal impedance of the clock output is 20 Ω. Decoupling Capacitor As with any high-performance mixed-signal IC, the ICS341 must be isolated from system power supply noise to perform optimally. A decoupling capacitor of 0.01µF must be connected between VDD and the PCB ground plane. Crystal Load Capacitors The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) been the crystal and device. Crystal capacitors must be connected from each of the pins X1 and X2 to ground. The value (in pF) of these crystal caps should equal (CL -6 pF)*2. In this equation, CL= crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 20 pF [(16-6) x 2] = 20. PCB Layout Recommendations For optimum device performance and lowest output phase noise, the following guidelines should be observed. 1) The 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace X1 / I CL K VDD GN D PDT S S0 S1 CL K X2 1 2 3 4 8 7 6 5 S1 S0 CLK (MHz) Spread Percentage 0 0 User Configurable User Configurable 01 User Configurable User Configurable 10 User Configurable User Configurable 11 User Configurable User Configurable Pin Number Pin Name Pin Type Pin Description 1 X1/ICLK XI Connect this pin to a crystal or external clock input. 2 VDD Power Connect to +3.3 V. 3 GND Power Connect to ground. 4 S0 Input Select pin 0 for frequency selection on CLK. Internal pull-up resistor. 5 CLK Output Clock output. Weak internal pull-down when tri-state. 6 S1 Input Select pin 1 for frequency selection on CLK. Internal pull-up resistor. 7PDTS Input Powers down entire chip. Tri-states CLK outputs when low. Internal pull-up resistor. 8 X2 XO Connect this pin to a crystal, or float for clock input. |
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