SNN60-RXP datasheet(1/2 Pages) LSTD

部件名	SNN60-RXP

功能描述	SNN60-RXP Form-In-Place

PDF	2 Pages

Scroll/Zoom	100%

制造商	LSTD [Laird Tech Smart Technology]

网页	http://www.lairdtech.com/

标志

1 / 2 page

Innovative Technology

for a Connected World

SNN60-RXP

Form-In-Place

TYPICAL VALUES

SNN60-RXP Form-In-Place

A rapid cure, silver/nickel-filled silicone elastomer Form-In-Place gasket material.

Laird Technologies introduces another product in the EMI Sentry family. These Form-In-Place pastes are

extremely fast curing with reliable shielding effectiveness and strength.

Laird Technologies’ Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding

and grounding gaskets onto metal or plastic substrates. This product is particularly ideal for base stations,

PDAs, PC cards, radios, mobile phones, as well as many other cast or plastic enclosures and packaged

electronic assemblies.

(a)

Compression-deflectionbeadsize0.62mm(H)x0.70mm(W)

global solutions: local support

TM

Americas: +1 866.928.8181

Europe: +49 8031.2460.0

Asia: +86 755.2714.1166

www.lairdtech.com

TEST METHOD

UNITS

SNN60-RXP

Elastomer

Silicone

Filler

Silver/Nickel

Color

Tan

ELECTRICAL PROPERTIES

Volume Resistivity

ohm-cm

0.005

Shielding Effectiveness

MIL-DTL-83528C

200MHzto10GHz

Para.4.5.12

dB

>100

PHYSICAL PROPERTIES

Hardness

ASTMD2240

Shore A

60

Tensile Strength

ASTMD412

psi

192

Tensile Elongation

ASTMD412

%

110

Density (cured)

ASTMD792

g/cm3

3.9

Density (uncured)

LT-FIP-CLE-09

g/cm3

3.1

Compression Set

ASTMD395

%

15

Adhesion Strength (Al)

LT-FIP-CLE-03

N/cm2

180

Compression-Deflection(a)

LT-FIP-CLE-07

at20%compression

lb/in

1.7

at40%compression

lb/in

6.4

Temperature Range

°C

-50°Cto125°C

UL rating

UL-94

V0

CURING REQUIREMENTS

Cure Conditions

15°Cto40°C,50%relativehumidity

At22°Cand50%RH

LT-FIP-CLE-14

Time before handling

1hour

Full Cure

24hours

rev.03/17/10

* does not represent

actual color

类似零件编号 - SNN60-RXP

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