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LMC555CBPEVAL 数据表(PDF) 2 Page - National Semiconductor (TI) |
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LMC555CBPEVAL 数据表(HTML) 2 Page - National Semiconductor (TI) |
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2 / 12 page ![]() Ordering Information Package Temperature Range Package Marking Transport Media NSC Drawing Industrial −40˚C to +85˚C 8-LeadSmall Outline (SO) LMC555CM LMC555CM Rails M08A LMC555CMX LMC555CM 2.5k Units Tape and Reel 8-Lead Mini Small Outline (MSOP) LMC555CMM ZC5 1k Units Tape and Reel MUA08A LMC555CMMX ZC5 3.5k Units Tape and Reel 8-Lead Molded Dip (MDIP) LMC555CN LMC555CN Rails N08E 8-Bump micro SMD LMC555CBP F1 250 Units Tape and Reel BPA08EFB LMC555CBPX F1 3k Units Tape and Reel Metronome Circuit LMC555CBPEVAL N/A N/A N/A micro SMD Marking Orientation Top View DS008669-23 Bumps are numbered counter-clockwise www.national.com 2 |
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