TM

Innovative Technology

for a Connected World

Thermally Conductive PCB Substrate

ULTRA-BRIGHT LED INSULATED METAL PRINTED CIRCUIT BOARD MATERIAL

Tlam IMPCB LLD is a copper circuit layer and aluminum or copper base plate bonded together with LLD

dielectric. Tlam IMPCB LLD is processed through standard FR4 print and etch operations.

LLD is designed for bright and ultra-bright LED module applications. LLD products have 6-8 times better

thermal conductivity compared to FR4, key to keeping components cool. LLD boards are

processed through standard pick-and-place SMT and manual wire bond operations.

Standard constructions are made with 1 or 2 ounce copper and 0.040 (1) or 0.062 (1.6) inch (mm)

thick aluminum.

FEATURES AND BENEFITS

• RoHS compliant

• Environmentally green

• Lead-free solder compatible

• Uses standard FR4 print and etch processing

Americas: +1.800.843.4556

Europe: +49.8031.2460.0

Asia: +86.755.2714.1166

CLV-customerservice@lairdtech.com

www.lairdtech.com/thermal

APPLICATIONS

•Highway and street lights using LEDs

• Railroad crossing signal lights using LEDs

• BLU for large format LCD TVs

• General lighting

THERMAL PROPERTIES

UNITS

Tlam IMPCB

LLD04

Thermal Conductivity

watt/mº-K

2.0

Thermal Resistance

0.07

(0.504)

Glass Transition Temperature

°C

165

Operating Temperature, Maximum

°C

150

Heat Capacity

J/g°C

1.12

ELECTRICAL PROPERTIES

UNITS

Tlam IMPCB

LLD04

Dielectric Constant @ 1KHz/1MHz

5.1/4.8

Dissipation Factor @ 1KHz

0.007

Capacitance @ 1 KHz

287 (44.5)

Volume Resistivity @25°C

ohm-cm

1.0E+15

Volume Resistivity @150°C

ohm-cm

2.0E+12

Surface Resistivity

ohm

1.5E+12

Dielectric Withstand (VDC)

VDC

1800

Dielectric Breakdown (VAC)

VAC

2500

Data for design engineer guidance only.

Typical values, observed performance varies in application.

Engineers are reminded to test the material in application.

Peel strength is measured with 1oz Cu.

MECHANICAL PROPERTIES

UNITS

Tlam IMPCB

LLD04

Dielectric Thickness

inch (mm)

0.004 (0.102)

Peel Strength

pli (kgf/cm)

6.0 (1.1)

CTE < Tg XY/Z axis

ppm/°C

16/36

CTE > Tg XY/Z axis

ppm/°C

18/155

Tensile Strength @ 25/150 °C MD/TD

MPa

88/57

Elongation 25/150 °C

%

0.8/1.0

Young's Modulus @ 25/150 °C

MPa

13180/6810

Poisson's Ratio 25/150 °C

0.277/0.263

Flexural Strength 25 °C

MPa

142

AGENCY RATINGS & DURABILITY

UNITS

Tlam IMPCB

LLD04

UL Flammability

E165095

94V0

Solder Float (4 min. @ 288 °C)

Pass

Comparative Tracking Index

600

THR-DS-Tlam-IMPCB-LLD 0412

Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and

application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the

fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages

of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request.

© Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technolo-

gies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party

intellectual property rights. A16230-00 REV C, 04/18/12.