3

Rev. 9/22/03

SP6213 Micropower, SC-70, 100mA CMOS LDO Regulator

© Copyright 2003 Sipex Corporation

Note 1. Exceeding the absolute maximum rating may damage the device.

Note 2. The device is not guaranteed to function outside its operating rating.

Note 3. The maximum allowable power dissipation at any T

Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the

regulator will go into thermal shutdown. The Q

board with minimum copper area (see “Thermal Considerations” section for further details).

Note 4. Output voltage temperature coefficient is defined as the worst case voltage change divided by the total

temperature range.

Note 5. Load Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts

are tested for load regulation in the load range. Changes in output voltage due to heating effects are

covered by the thermal regulation specification.

Note 6. Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below

its nominal value measured at 0.5V differential. Not applicable to output voltages less than 2.7V.

Note 7. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum

of the load current plus the ground pin current.

Note 8. Thermal regulation is defined as the change in output voltage at a time ”t” after a change inpower

dissipation is applied, excluding load or line regulation effects. Specifications are for a 100mA load pulse

at V

Note 9.Devices are ESD sensitive. Handling precautions are recommended.

R

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m

0

0

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=

ELECTRICAL SPECIFICATIONS: Continued

V

the full operating temperature range, unless otherwise specified.