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LMC6484AMWG/883 数据表(PDF) 14 Page - National Semiconductor (TI) |
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LMC6484AMWG/883 数据表(HTML) 14 Page - National Semiconductor (TI) |
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14 / 22 page ![]() Application Information (Continued) of the ultra-low input current of the LMC6484, typically less than 20 fA, it is essential to have an excellent layout. Fortu- nately, the techniques of obtaining low leakages are quite simple. First, the user must not ignore the surface leakage of the PC board, even though it may sometimes appear accept- ably low, because under conditions of high humidity or dust or contamination, the surface leakage will be appreciable. To minimize the effect of any surface leakage, lay out a ring of foil completely surrounding the LMC6484’s inputs and the terminals of capacitors, diodes, conductors, resistors, relay terminals, etc. connected to the op-amp’s inputs, as in Fig- ure 9. To have a significant effect, guard rings should be placed in both the top and bottom of the PC board. This PC foil must then be connected to a voltage which is at the same voltage as the amplifier inputs, since no leakage current can flow between two points at the same potential. For example, a PC board trace-to-pad resistance of 10 12 Ω, which is nor- mally considered a very large resistance, could leak 5 pA if the trace were a 5V bus adjacent to the pad of the input. This would cause a 250 times degradation from the LMC6484’s actual performance. However, if a guard ring is held within 5 mV of the inputs, then even a resistance of 10 11 Ω would cause only 0.05 pA of leakage current. See Figure 10 for typical connections of guard rings for standard op-amp configurations. The designer should be aware that when it is inappropriate to lay out a PC board for the sake of just a few circuits, there is another technique which is even better than a guard ring on a PC board: Don’t insert the amplifier’s input pin into the board at all, but bend it up in the air and use only air as an in- sulator. Air is an excellent insulator. In this case you may have to forego some of the advantages of PC board con- struction, but the advantages are sometimes well worth the effort of using point-to-point up-in-the-air wiring. See Figure 11. DS011714-20 FIGURE 9. Example of Guard Ring in P.C. Board Layout DS011714-21 Inverting Amplifier DS011714-22 Non-Inverting Amplifier DS011714-23 Follower FIGURE 10. Typical Connections of Guard Rings DS011714-24 (Input pins are lifted out of PC board and soldered directly to components. All other pins connected to PC board.) FIGURE 11. Air Wiring www.national.com 14 |
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