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WTS701MF/T 数据表(PDF) 74 Page - Winbond

部件名 WTS701MF/T
功能描述  WINBOND SINGLE-CHIP TEXT-TO-SPEECH PROCESSOR
PDF  77 Pages
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制造商  WINBOND [Winbond]
网页  http://www.winbond.com
标志 WINBOND - Winbond

WTS701MF/T 数据表(HTML) 74 Page - Winbond

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WTS701
- 74 -
11. TYPICAL APPLICATION CIRCUIT
The following schematic diagrams are extracted from the WTS-ES701 evaluation board schematic.
The evaluation system includes the following basic clusters:
WTS701 processor cluster working with 3.3V, including an 8-ohm speaker,
SPI connector to the host PC via the PC parallel port.
For more information about the evaluation system, please refer to the WTS-ES701 User’s Guide.
PAD_SPK-
PAD_FS
PG 1,3
PAD_RDY
PAD_SPK+
PAD_RESET
Y2
XTAL
PAD_XTO
PG 1
J2
MJ-3536N
1
2
3
PAD_MOSI
PG 1,3
J7
1
2
3
PAD_MISO
PG 1,3
AUXOUT
U5
WTS701
25
15
16
14
6
26
13
8
7
52
40
42
5
4
3
2
36
46
9
10
11
12
27
44
48
54
CSB
SSB
SCLK
MOSI
MISO
RDY
INTB
XTI
XTO
AUXIN
ATTCAP
SPK-
VDX
VFS
VCLK
VSSA1
VSSA2
SPK+
VSSDN
VSSD
VCCD
VCCDN
RESET
VSSA3
VCCA
AUXOUT
PAD_XTO
PAD_XTI
R11 33K
C18
10PF
VCCD
PAD_DIN
PAD_AUXOUT
PAD_ATTCAP
U6
CRYSTAL SOCKET
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1
2
3
4
5
6
78
9
10
11
12
13
14
C23
.1UF
PAD_AUXIN
J4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
C19
10PF
R13
10K
PAD_BCLK
PAD_SCLK
CSB
PAD_XTI
J5
MJ-3536N
1
2
3
VCCA
C17
.1UF
PAD_RDY
PAD_BCLK
PG 1,3
PAD_AUXOUT PG 1
C25
.1UF
PAD_RESET
PG 1,3
PAD_RDY
PG 1,3
PAD_SPK- PG 1
PAD_ATTCAP
PAD_AUXOUT
PAD_INTB
GNDA
SPEAKER
VCCD
PAD_AUXIN
PAD_MOSI
PAD_DIN
PG 1,3
VCCA
PAD_FS
C24
.1UF
VCCD
C21
.1UF
VCCD
PAD_SCLK
PG 1,3
PAD_SPK+ PG 1
PAD_XTI
PG 1
VCCD
PAD_MISO
R9 33K
PAD_INTB
PG 1,3
C22
.1UF
PAD_INTB
PAD_SSB
PG 1,3
R12
33K
+
R8
10K
AUXIN
CSB
PG 1
VCCA
R10 33K
C20
4.7UF
J1
MJ-3536N
1
2
3
PAD_XTO
Label pins
of J4 with
signal
names.
VCCD
VCCA
GND
PAD_SSB
PAD_SPK-
PAD_ATTCAP PG 1
PAD_AUXIN PG 1
PAD_MISO
PAD_SPK+
C26
.1UF



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