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ADR395BUJZ-R2 数据表(PDF) 16 Page - Analog Devices |
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ADR395BUJZ-R2 数据表(HTML) 16 Page - Analog Devices |
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16 / 20 page ![]() ADR390/ADR391/ADR392/ADR395 Rev. F | Page 16 of 20 THEORY OF OPERATION Band gap references are the high performance solution for low supply voltage and low power voltage reference applications, and the ADR390/ADR391/ADR392/ADR395 are no exception. The uniqueness of these devices lies in the architecture. As shown in Figure 40, the ideal zero TC band gap voltage is referenced to the output, not to ground. Therefore, if noise exists on the ground line, it is greatly attenuated on VOUT. The band gap cell consists of the PNP pair, Q51 and Q52, running at unequal current densities. The difference in VBE results in a voltage with a positive TC, which is amplified by a ratio of R54 R58 2 × This PTAT voltage, combined with VBEs of Q51 and Q52, produces a stable band gap voltage. Reduction in the band gap curvature is performed by the ratio of the resistors R44 and R59, one of which is linearly temperature dependent. Precision laser trimming and other patented circuit techniques are used to further enhance the drift performance. SHDN R60 Q51 R54 R61 R53 Q52 R58 R59 R44 R48 R49 Q1 VIN VOUT (FORCE) VOUT (SENSE) GND Figure 40. Simplified Schematic DEVICE POWER DISSIPATION CONSIDERATIONS The ADR390/ADR391/ADR392/ADR395 are capable of deli- vering load currents to 5 mA, with an input voltage that ranges from 2.8 V (ADR391 only) to 15 V. When these devices are used in applications with large input voltages, care should be taken to avoid exceeding the specified maximum power dissipation or junction temperature because it could result in premature device failure. The following formula should be used to calcu-late a device’s maximum junction temperature or dissipation: JA A J D T – T P θ = In this equation, TJ and TA are, respectively, the junction and ambient temperatures. PD is the device power dissipation, and θJA is the device package thermal resistance. SHUTDOWN MODE OPERATION The ADR390/ADR391/ADR392/ADR395 include a shutdown feature that is TTL/CMOS level compatible. A logic low or a zero volt condition on the SHDN pin is required to turn the devices off. During shutdown, the output of the reference becomes a high impedance state, where its potential would then be determined by external circuitry. If the shutdown feature is not used, the SHDN pin should be connected to VIN (Pin 2). |
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