IPS511/IPS511S

2

www.irf.com

(1) Limited by junction temperature (pulsed current limited also by internal wiring)

Symbol Parameter

Min.

Typ.

Max. Units Test Conditions

Rth 1

Thermal resistance junction to case

—

#

—

Rth 2

Thermal resistance junction to ambient

—

$

—

Rth 1

Thermal resistance with standard footprint

—

60

—

Rth 2

Thermal resistance with 1" square footprint

—

40

—

Rth 3

Thermal resistance junction to case

—

#

—

Thermal Characteristics

TO-220

Absolute Maximum Ratings

Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters

are referenced to GROUND lead. (Tj = 25

Symbol Parameter

Min.

Max.

Units

Test Conditions

Vout

Maximum output voltage

Vcc-50 Vcc+0.3

Voffset

Maximum logic ground to load ground offset Vcc-50 Vcc+0.3

Vin

Maximum Input voltage

-0.3

5.5

Vcc max

Maximum Vcc voltage

—

50

Iin, max.

Maximum IN current

-5

10

mA

Vdg

Maximum diagnostic output voltage

-0.3

5.5

V

Idg, max

Maximum diagnostic output current

-1

10

mA

—

2.2

—10

ESD1

—

4

C=100pF, R=1500

Ω,

ESD2

—

0.5

C=200pF, R=0

Ω, L=10µH

Pd

Maximum power dissipation

(1)

—

25

—

1.56

Tj max.

Max. storage & operating junction temp.

-40

+150

Tlead

Lead temperature (soldering 10 seconds)

—

300

V

A

kV

W