LP3990 datasheet(6/13 Pages) NSC

6 / 13 page

Electrical Characteristics (Continued)

Unless otherwise noted, V

EN =950mV, VIN =VOUT + 1.0V, or 2.0V, whichever is higher. CIN = 1 µF, IOUT = 1 mA, COUT =0.47

µF. Typical values and limits appearing in normal type apply for T

J = 27˚C. Limits appearing in boldface type apply over the

full junction temperature range for operation, −40 to +125˚C. (Note 13)

Symbol

Parameter

Conditions

Typ

Limit

Units

Min

Max

Output noise Voltage (Note 10)

BW = 10Hz to

100kHz,

OUT = 0.8

µV

RMS

OUT = 1.5

125

OUT = 3.3

180

SHUTDOWN

Thermal Shutdown

Temperature

155

˚C

Hysteresis

Enable Control Characteristics

(Note 12)

Maximum Input Current at

EN Input

EN = 0.0V

0.001

0.1

µA

EN =6V

2.5

Low Input Threshold

IN =2Vto6V

0.4

High Input Threshold

IN =2Vto6V

0.95

Timing Characteristics

Turn On Time (Note 10)

To 95% Level

IN(MIN) to 6.0V

OUT = 0.8

150

µs

OUT = 1.5

105

200

OUT = 3.3

175

250

Transient

Response

Line Transient Response |

δV

OUT|Trise =Tfall = 30µs (Note 10)

δV

IN = 600mV

(pk - pk)

Load Transient Response

δV

OUT|

rise =Tfall = 1µs (Note 10)IOUT = 1mA

to 150mA

OUT = 1µF

Note 1: Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the device is

guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 2: All Voltages are with respect to the potential at the GND pin.

Note 3: For further information on these packages please refer to the following application notes;AN-1112 Micro SMD Package Wafer Level Chip Scale

Package,AN-1187 Leadless Leadframe Package.

Note 4: Internal thermal shutdown circuitry protects the device from permanent damage.

Note 5: The human body model is 100pF discharged through a 1.5k

Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each

pin.

Note 6: The maximum ambient temperature (TA(max)) is dependant on the maximum operating junction temperature (TJ(max-op) = 125˚C), the maximum power

dissipation of the device in the application (PD(max)), and the junction to ambient thermal resistance of the part/package in the application (θJA), as given by the

following equation: TA(max) =TJ(max-op) -(θJA xPD(max)).

Note 7: Dropout voltage is voltage difference between input and output at which the output voltage drops to 100mV below its nominal value. This parameter only

for output voltages above 2.0V.

Note 8: Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power dissipation is possible,

special care must be paid to thermal dissipation issues in board design.

Note 9: The device maintains the regulated output voltage without the load.

Note 10: This electrical specification is guaranteed by design.

Note 11: Short circuit current is measured with VOUT pulled to 0V and VIN worst case = 6.0V.

Note 12: Enable Pin has 1M

Ω typical, resistor connected to GND.

Note 13: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production at TJ = 25˚C or correlated using

Statistical Quality Control methods. Operation over the temperature specification is guaranteed by correlating the electrical characteristics to process and

temperature variations and applying statistical process control.

Note 14: VIN(MIN) =VOUT(NOM) + 0.5V, or 2.0V, whichever is higher.

Output Capacitor, Recommended Specifications

Symbol

Parameter

Conditions

Typ

Limit

Units

Min

Max

OUT

Output Capacitor

Capacitance

(Note 15)

-40˚C to +125˚C

1.0

0.68

µF

0˚C to +125˚C

0.47

0.33

ESR

500

Ω

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