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STPS140U 数据表(PDF) 4 Page - STMicroelectronics |
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STPS140U 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 7 page ![]() STPS140 4/7 Figure 11: Forward voltage drop versus forward current (maximum values) Figure 12: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMA) Figure 13: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35µm) (SMB) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1E-2 1E-1 1E+0 1E+1 I (A) FM V (V) FM T =125°C j 01 2 3 4 5 0 20 40 60 80 100 120 140 S(Cu)(cm²) R (°C/W) th(j-a) P=1.5W 012 345 0 20 40 60 80 100 120 S(Cu)(cm²) R (°C/W) th(j-a) P=1.5W |
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