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LP2956 数据表(PDF) 10 Page - National Semiconductor (TI) |
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LP2956 数据表(HTML) 10 Page - National Semiconductor (TI) |
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10 / 16 page ![]() Application Hints HEATSINK REQUIREMENTS A heatsink may be required with the LP2956 depending on the maximum power dissipation and maximum ambient tem- perature of the application. Under all expected operating conditions, the junction temperature must be within the range specified under Absolute Maximum Ratings. To determine if a heatsink is required, the maximum power dissipated by the regulator, P(max), must be calculated. It is important to remember that if the regulator is powered from a transformer connected to the AC line, the maximum specified AC input voltage must be used (since this pro- duces the maximum DC input voltage to the regulator). Fig- ure 1 shows the voltages and currents which are present in the circuit. The formula for calculating the power dissipated in the regulator is also shown in Figure 1 (the currents and power due to external resistive dividers are not included, and are typically negligible). The next parameter which must be calculated is the maxi- mum allowable temperature rise, T R(max). This is calculated by using the formula: T R(max) = TJ(max) − T A(max) where: T J(max) is the maximum allowable junction tem- perature T A(max) is the maximum ambient temperature Using the calculated values for T R(max) and P(max), the re- quired value for junction-to-ambient thermal resistance, θ (J-A) , can now be found: θ (J-A) = TR(max)/P(max) The heatsink for the LP2956 is made using the PC board copper. The heat is conducted from the die, through the lead frame (inside the part), and out the pins which are soldered to the PC board. The pins used for heat conduction are shown in Table 1. TABLE 1. Part Package Pins LP2956IN 16-Pin Plastic DIP 4, 5, 12, 13 LP2956AIN 16-Pin Plastic DIP 4, 5, 12, 13 LP2956IM 16-Pin Surface Mt. 1, 8, 9, 16 LP2956AIM 16-Pin Surface Mt. 1, 8, 9, 16 Figure 2 shows copper patterns which may be used to dissi- pate heat from the LP2956: Table 2 shows some typical values of junction-to-ambient thermal resistance ( θ J-A) for values of L and W (1 oz. cop- per). TABLE 2. Package L (In.) H (In.) θ J-A (˚C/W) 16-Pin Plastic 1 0.5 70 DIP 2 1 60 3 1.5 58 4 0.19 66 6 0.19 66 16-Pin 1 0.5 83 Surface 2 1 70 Mount 3 1.5 67 6 0.19 69 4 0.19 71 2 0.19 73 EXTERNAL CAPACITORS A 2.2 µF (or greater) capacitor is required between the main output pin and ground to assure stability. The auxiliary output requires 10 µF to ground. Without these capacitors, the part may oscillate. Most types of tantalum or aluminum electrolyt- ics will work here. Film types will work, but are more expen- sive. Many aluminum electrolytics contain electrolytes which freeze at −30˚C, which requires the use of solid tantalums below −25˚C. The important characteristic of the capacitors is an ESR of 5 Ω (or less) on the main regulator output and an ESR of 1 Ω (or less) on the auxiliary regulator output (the DS011339-9 FIGURE 1. Current/Voltage Diagram DS011339-10 *For best results, use L = 2H FIGURE 2. Copper Heatsink Patterns www.national.com 10 |
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