LP2954IM datasheet(4/13 Pages) NSC

4 / 13 page

Electrical Characteristics (Continued)

Limits in standard typeface are for T

J = 25˚C, bold typeface applies over the −40˚C to +125˚C temperature range. Limits

are guaranteed by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Un-

less otherwise noted: V

IN = 6V, IL = 1 mA, CL = 2.2 µF.

Symbol

Parameter

Conditions

Typical

2954AI

2954I

Units

Min

Max

Min

Max

Additional Specifications for the Adjustable Device (LP2954AIM and LP2954IM)

REF

Reference Voltage

(Note 10)

1.230

1.215

1.205

1.245

1.255

1.205

1.190

1.255

1.270

∆V

REF/

REF

Reference Voltage

Line Regulation

IN=2.5V to

VO(NOM)+1V

0.03

0.1

0.2

IN=2.5V to

VO(NOM)+1V to 30V

(Note 11)

0.2

0.4

∆V

REF/∆T

Reference Voltage

Temperature

Coefficient

(Note 3)

ppm/˚C

B(FB)

Feedback Pin Bias

Current

GND

Ground Pin Current

at Shutdown (Note

SHUTDOWN≤1.1V

105

140

µA

O(SINK)

Output

″OFF″

Pulldown Current

(Note 12)

Dropout Detection Comparator

Output

″HIGH″

Leakage Current

OH=30V

0.01

µA

Output

″LOW″

Voltage

IN=VO(NOM)−0.5V

O(COMP)=400µA

150

250

400

250

400

THR(MAX)

Upper Threshold

Voltage

(Note 13)

−60

−80

−95

−35

−25

−80

−95

−35

−25

THR(MIN)

Lower Threshold

Voltage

(Note 13)

−85

−110

−160

−55

−40

−110

−160

−55

−40

HYST

Hysteresis

(Note 13)

Shutdown Input

Input Offset Voltage

(Referred to V

REF)

±3

−7.5

−10

7.5

−7.5

−10

7.5

HYST

Hysteresis

Input Bias Current

IN(S/D)=0V to 5V

−30

−50

−30

−50

Note 1: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the de-

vice outside of its rated operating conditions.

Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ (MAX), the junction-to-ambient thermal resistance, θJ-A,

and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using:

Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The junction-to-ambient

thermal resistance of the TO-220 (without heatsink) is 60˚C/W, 73˚C/W for the TO-263, and 160˚C/W for the SO-8. If the TO-263 package is used, the thermal re-

sistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area,

θJA is 50˚C/W; with

1 square inch of copper area,

θJA is 37˚C/W; and with 1.6 or more square inches of copper area, θJA is 32˚C/W. The junction-to-case thermal resistance is 3˚C/W.

If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the junction-to-case resistance (3˚C/W), the specified thermal re-

sistance of the heatsink selected, and the thermal resistance of the interface between the heatsink and the LP2954. Some typical values are listed for interface ma-

terials used with TO-220:

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