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LP2985 数据表(PDF) 16 Page - National Semiconductor (TI) |
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LP2985 数据表(HTML) 16 Page - National Semiconductor (TI) |
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16 / 21 page ![]() Application Hints (Continued) It should also be noted that the ESR of a typical Tantalum will increase about 2:1 as the temperature goes from 25˚C down to −40˚C, so some guard band must be allowed. On/off Input Operation The LP2985 is shut off by driving the ON/OFF input low, and turned on by pulling it high. If this feature is not to be used, the ON/OFF input should be tied to V IN to keep the regulator output on at all times. To assure proper operation, the signal source used to drive the ON/OFF input must be able to swing above and below the specified turn-on/turn-off voltage thresholds listed in the Electrical Characteristics section under V ON/OFF. To prevent mis-operation, the turn-on (and turn-off) voltage signals ap- plied to the ON/OFF input must have a slew rate which is ≥ 40 mV/µs. Caution: the regulator output voltage can not be guaranteed if a slow-moving AC (or DC) signal is applied that is in the range between the specified turn-on and turn-off voltages listed under the electrical specification V ON/OFF (see Electri- cal Characteristics). REVERSE INPUT-OUTPUT VOLTAGE The PNP power transistor used as the pass element in the LP2985 has an inherent diode connected between the regu- lator output and input. During normal operation (where the input voltage is higher than the output) this diode is reverse- biased. However, if the output is pulled above the input, this diode will turn ON and current will flow into the regulator output. In such cases, a parasitic SCR can latch which will allow a high current to flow into V IN (and out the ground pin), which can damage the part. In any application where the output may be pulled above the input, an external Schottky diode must be connected from V IN to VOUT (cathode on VIN, anode on VOUT), to limit the reverse voltage across the LP2985 to 0.3V (see Absolute Maximum Ratings). MICRO SMD MOUNTING The micro SMD package requires specific mounting tech- niques which are detailed in National Semiconductor Appli- cation Note # 1112. Referring to the section Surface Mount Technology (SMT) Assembly Considerations, it should be noted that the pad style which must be used with the 5-pin package is the NSMD (non-solder mask defined) type. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. MICRO SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct sunlight will cause misoperation of the device. Light sources such as Halogen lamps can also affect electrical performance if brought near to the device. The wavelenghts which have the most detrimental effect are reds and infra-reds, which means that the fluorescent light- ing used inside most buildings has very little effect on per- formance. A micro SMD test board was brought to within 1 cm of a fluorescent desk lamp and the effect on the regu- lated output voltage was negligible, showing a deviation of less than 0.1% from nominal. www.national.com 16 |
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