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Document Number: 93141

2

Revision: 22-Oct-08

20ETF..S Soft Recovery Series

Vishay High Power Products

Fast Soft Recovery

Rectifier Diode, 20 A

Note

For recommended footprint and soldering techniques refer to application note #AN-994

ELECTRICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum forward voltage drop

1.31

V

Forward slope resistance

11.88

m

Ω

Threshold voltage

0.93

V

Maximum reverse leakage current

0.1

mA

6

RECOVERY CHARACTERISTICS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Reverse recovery time

25 A/µs

25 °C

400

ns

Reverse recovery current

6.1

A

Reverse recovery charge

1.7

µC

Snap factor

S

Typical

0.6

I

FM

t

rr

dir

dt

I

RM(REC)

Q

rr

t

t

a

t

b

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

VALUES

UNITS

Maximum junction and storage

temperature range

- 40 to 150

°C

Maximum thermal resistance,

junction to case

DC operation

0.9

°C/W

Maximum thermal resistance,

junction to ambient (PCB mount)

62

Soldering temperature

240

°C

Approximate weight

2g

0.07

oz.

Marking device

20ETF08S

20ETF10S

20ETF12S