LP2951 datasheet(7/26 Pages) NSC

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Electrical Characteristics (Note 2) (Continued)

Parameter

Conditions

(Note 2)

LP2951

LP2950AC-XX

LP2950C-XX

Units

LP2951AC-XX

LP2951C-XX

Tested

Design

Tested

Design

Typ

Limit

Typ

Limit

Typ

Limit

(Notes 3, 16)

(Note 3)

(Note 4)

(Note 3)

(Note 4)

All Voltage Options

Temperature

Coefficient

Feedback Pin Bias

0.1

nA/˚C

Current Temperature

Coefficient

Error Comparator

Output Leakage

OH = 30V

0.01

µA max

Current

µA max

Output Low

in =(VONOM −

0.5)V

150

250

150

250

150

250

mV max

Voltage

OL = 400µA

400

mV max

Upper Threshold

(Note 6)

mV min

Voltage

mV min

Lower Threshold

(Note 6)

mV max

Voltage

140

mV max

Hysteresis

(Note 6)

Shutdown Input

Input

1.3

Logic

Low (Regulator

ON)

0.6

0.7

V max

Voltage

High (Regulator

OFF)

2.0

V min

Shutdown Pin Input

Current

shutdown = 2.4V

µA max

100

µA max

shutdown = 30V

450

600

450

600

450

600

µA max

750

µA max

Regulator Output

Current in Shutdown

(Note 11)

µA max

Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device

is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical

Characteristics tables.

Note 2: Unless otherwise specified all limits guaranteed for VIN =(VONOM + 1)V, IL = 100µA and CL = 1µF for 5V versions and 2.2µF for 3V and 3.3V versions. Limits

appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA =TJ = 25˚C. Additional

conditions for the 8-pin versions are FEEDBACK tied to VTAP, OUTPUT tied to SENSE, and VSHUTDOWN ≤ 0.8V.

Note 3: Guaranteed and 100% production tested.

Note 4: Guaranteed but not 100% production tested. These limits are not used to calculate outgoing AQL levels.

Note 5: Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential.

At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over temperature) must be taken into account.

Note 6: Comparator thresholds are expressed in terms of a voltage differential at the Feedback terminal below the nominal reference voltage measured at Vin =

(VONOM + 1)V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain = Vout/Vref = (R1 + R2)/R2.For example, at a

programmed output voltage of 5V, the Error output is guaranteed to go low when the output drops by 95mV x 5V/1.235V = 384 mV. Thresholds remain constant as

a percent of Vout as Vout is varied, with the dropout warning occurring at typically 5% below nominal, 7.5% guaranteed.

Note 7: Vref ≤ Vout ≤ (Vin − 1V), 2.3V ≤ Vin ≤ 30V, 100µA ≤ IL ≤ 100mA, TJ ≤ TJMAX.

Note 8: The junction-to-ambient thermal resistances are as follows: 180˚C/W and 160˚C/W for the TO-92 package with 0.40 inch and 0.25 inch leads to the printed

circuit board (PCB) respectively, 105˚C/W for the molded plastic DIP (N), 130˚C/W for the ceramic DIP (J), 160˚C/W for the molded plastic SOP (M), 200˚C/W for

the molded plastic MSOP (MM), and 160˚C/W for the metal can package (H). The above thermal resistances for the N, J, M, and MM packages apply when the

package is soldered directly to the PCB. Junction-to-case thermal resistance for the H package is 20˚C/W. Junction-to-case thermal resistance for the TO-252

package is 5.4˚C/W. The value of

θJA for the LLP package is typically 51˚C/W but is dependent on the PCB trace area, trace material, and the number of layers and

thermal vias. For details of thermal resistance and power dissipation for the LLP package, refer to Application Note AN-1187.

Note 9: May exceed input supply voltage.

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