FT230XQ-R datasheet(39/44 Pages) FTDI

39 / 44 page

FT230X USB TO BASIC UART IC

Version 1.4

Document No.: FT_000566 Clearance No.: FTDI# 260

9.5 Solder Reflow Profile

The FT230X is supplied in Pb free 16 LD SSOP and QFN-16 packages. The recommended solder reflow

profile for both package options is shown in Figure 9.5.

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

Figure 9.5 FT230X Solder Reflow Profile

The recommended values for the solder reflow profile are detailed in Table 9.1. Values are shown for both

a completely Pb free solder process (i.e. the FT230X is used with Pb free solder), and for a non-Pb free

solder process (i.e. the FT230X is used with non-Pb free solder).

Profile Feature

Pb Free Solder Process

Non-Pb Free Solder Process

Average Ramp Up Rate (Ts to Tp)

3°C / second Max.

3°C / Second Max.

Preheat

- Temperature Min (Ts Min.)

- Temperature Max (Ts Max.)

- Time (ts Min to ts Max)

150°C

200°C

60 to 120 seconds

100°C

150°C

60 to 120 seconds

Time Maintained Above Critical Temperature

TL:

- Temperature (TL)

- Time (tL)

217°C

60 to 150 seconds

183°C

60 to 150 seconds

Peak Temperature (Tp)

260°C

240°C

Time within 5°C of actual Peak Temperature

(tp)

20 to 40 seconds

Ramp Down Rate

6°C / second Max.

Time for T= 25°C to Peak Temperature, Tp

8 minutes Max.

6 minutes Max.

Table 9.1 Reflow Profile Parameter Values

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