181 CPL

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Vishay BCcomponents

Revision: 15-Jul-16

3

Document Number: 28417

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Table 1

Table 2

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print

layout and / or adjacent components.

For recommended soldering pad dimensions, refer to Fig. 3

and Table 3.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

component during processing.

For maximum conditions refer to Fig. 4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

As a general principle, temperature and duration shall be the

minimum necessary required to ensure good soldering

connections. However, the specified maximum curves

should never be exceeded.

Fig. 3 - Recommended soldering pad dimensions

DIMENSIONS in millimeters AND MASS

NOMINAL

CASE SIZE

L x W x H

CASE

CODE

Ø D

MASS

(g)

6.6 x 6.6 x 5.9

0606

6.8

6.8

6

6.3

0.8

2.0

7.4

~ 0.25

8.4 x 8.4 x 6.7

0807

8.6

8.6

7

8

1.1

3.1

9.2

~ 0.5

8.4 x 8.4 x 12

0812

8.6

8.6

12.5

8

1.1

3.1

9.2

~ 0.8

10.4 x 10.4 x 7.7

1008

10.6

10.6

8

10

1.3

4.7

11.2

~ 0.9

10.4 x 10.4 x 12.6

1013

10.6

10.6

12.7

10

1.3

4.7

11.2

~ 1.3

TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES

NOMINAL

CASE SIZE

L x W x H

CASE

CODE

PITCH

TAPE WIDTH

W

TAPE

THICKNESS

REEL DIAMETER

PACKAGING

QUANTITY

PER REEL

6.6 x 6.6 x 5.9

0606

12

16

6.2

380

1000

8.4 x 8.4 x 6.7

0807

12

16

6.8

380

1000

8.4 x 8.4 x 12

0812

16

16

13.0

380

400

10.4 x 10.4 x 7.7

1008

16

24

10.0

380

500

10.4 x 10.4 x 12.6

1013

16

24

14.0

380

400

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c

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