IRK.166, .196, .236 Series

3

Bulletin I27116 rev. C 03/02

www.irf.com

Thermal and Mechanical Specifications

T

J

Max. junction operating

-40 to 150

°C

temperature range

T

stg

Max. storage temperature

-40 to 150

°C

range

0.2

0.16

0.14

K/W

DC operation, per junction

junction to case

0.05

K/W

Mounting surface smooth, flat and greased

case to heatsink

Per module

T

Mounting

IAP to heatsink

4 to 6

Nm

torque ± 10%

busbar to IAP

4 to 6

wt

Approximate weight

200 (7.1)

g (oz)

Case Style

New Int-A-Pak

A mounting compound is recommended and

the

torque should be rechecked after a

period of 3 hours to allow for the spread of the

compound.Lubricatedthreads.

Parameter

IRK.166

IRK.196

IRK.236

Units Conditions

Devices

Units

IRK.166

0.025

0.03

0.038

0.055

0.089

0.018

0.031

0.041

0.057

0.089

IRK.196

0.016

0.019

0.024

0.034

0.053

0.012

0.02

0.026

0.035

0.054

K/W

IRK.236

0.009

0.010

0.014

0.018

0.025

0.008

0.012

0.015

0.019

0.025

∆R Conduction (per Junction)

(The following table shows the increment of thermal resistance R

1

2

3

1

-

Module Type

2

-

Circuit Configuration

3

-

Current Rating: I

F(AV)

4

-

Voltage Code: Code x 100 = V

RRM

4

Device Code

Ordering Information Table

IRK

D

236

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