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BAT30F4 数据表(PDF) 2 Page - STMicroelectronics |
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BAT30F4 数据表(HTML) 2 Page - STMicroelectronics |
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2 / 10 page ![]() Characteristics BAT30F4 2/10 DocID025780 Rev 5 1 Characteristics Table 2. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF Continuous forward current 300 mA IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 4 A PD (1) 1. On epoxy printed circuit board with minimum recommended footprint Power dissipation 200 mW Tstg Storage temperature range -55 to +150 °C Top Operating junction temperature range -30 to +85 °C Tj Maximum junction temperature in DC forward mode 150 °C TL Maximum soldering temperature during 10 s 260 °C Table 3. Thermal parameter Symbol Parameter Value (typ.) Unit Rth(j-a) Junction to ambient(1) 1. On epoxy printed circuit board with minimum recommended footprint 450 °C/W Table 4. Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) 1. Pulse test: tp = 5 ms, < 2% Reverse leakage current Tj = 25 °C VR = 10 V -2.2 µA Tj = 85 °C - 300 Tj = 25 °C VR = 30 V -50 Tj = 85 °C - 1600 VF (2) 2. Pulse test: tp = 380 µs, < 2% Forward voltage drop Tj = 25 °C IF = 5 mA -0.285 V Tj = 85 °C - 0.205 Tj = 25 °C IF = 10 mA - 0.27 0.31 Tj = 85 °C - 0.24 Tj = 25 °C IF = 100 mA - 0.39 0.44 Tj = 85 °C - 0.40 Tj = 25 °C IF = 300 mA -0.55 0.625 Tj = 85 °C - 0.64 |
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