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LPS25H 数据表(PDF) 13 Page - STMicroelectronics |
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LPS25H 数据表(HTML) 13 Page - STMicroelectronics |
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13 / 45 page  DocID023722 Rev 5 13/45 LPS25H Application hints 45 4 Application hints Figure 5. LPS25H electrical connection The device core is supplied through the VDD line. Power supply decoupling capacitors (100 nF, 4.7 µF) should be placed as near as possible to the supply pad of the device (common design practice). The functionality of the device and the measured data outputs are selectable and accessible through the I²C/SPI interface. When using the I²C, CS must be tied high (i.e. connected to VDD_IO). 4.1 Soldering information The HCLGA package is compliant with the ECOPACK® standard and it is qualified for soldering heat resistance according to JEDEC J-STD-020. 1 6 2 3 4 5 7 8 9 10 TOP VIEW INT 1 CS VDD_IO SCL/SPC GND VDD GND VDD GND C1 C2 4.7 µF 100 µF GND |
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