MP34DB02

Package information

DocID026103 Rev 2

13/17

7

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK

7.1

Soldering information

The RHLGA (3 x 4 x 1) mm package is also compliant with the RoHS and “Green”

standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Landing pattern and soldering recommendations are available at www.st.com.

Figure 6: Recommended soldering profile limits

Table 8: Recommended soldering profile limits

Desription

Parameter

Pb free

Average ramp rate

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

Time maintained above liquidus temperature

Liquidus temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max