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TLV70213DBVT 数据表(PDF) 2 Page - Texas Instruments |
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TLV70213DBVT 数据表(HTML) 2 Page - Texas Instruments |
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2 / 33 page ![]() TLV702 SLVSAG6C – SEPTEMBER 2010 – REVISED MARCH 2015 www.ti.com Table of Contents 8.1 Application Information............................................ 13 1 Features .................................................................. 1 8.2 Typical Application .................................................. 13 2 Applications ........................................................... 1 9 Power Supply Recommendations ...................... 15 3 Description ............................................................. 1 9.1 Power Dissipation ................................................... 15 4 Revision History..................................................... 2 10 Layout................................................................... 15 5 Pin Configuration and Functions ......................... 3 10.1 Layout Guidelines ................................................. 15 6 Specifications......................................................... 4 10.2 Layout Examples................................................... 15 6.1 Absolute Maximum Ratings ...................................... 4 10.3 Thermal Consideration.......................................... 16 6.2 ESD Ratings ............................................................ 4 10.4 Package Mounting ................................................ 16 6.3 Recommended Operating Conditions ....................... 4 11 Device and Documentation Support ................. 17 6.4 Thermal Information .................................................. 4 11.1 Device Support .................................................... 17 6.5 Electrical Characteristics........................................... 5 11.2 Documentation Support ........................................ 17 6.6 Typical Characteristics .............................................. 6 11.3 Related Links ........................................................ 17 7 Detailed Description ............................................ 10 11.4 Trademarks ........................................................... 18 7.1 Overview ................................................................. 10 11.5 Electrostatic Discharge Caution ............................ 18 7.2 Functional Block Diagrams ..................................... 10 11.6 Glossary ................................................................ 18 7.3 Feature Description................................................. 11 12 Mechanical, Packaging, and Orderable 7.4 Device Functional Modes........................................ 12 Information ........................................................... 18 8 Application and Implementation ........................ 13 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (February 2011) to Revision C Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................. 1 • Changed Pin Configuration and Functions section; updated table format ............................................................................ 3 • Deleted Ordering Information table ....................................................................................................................................... 3 • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement ................... 4 • Changed Thermal Information table; updated thermal resistance values for all packages .................................................. 4 • Deleted Dissipation Ratings table .......................................................................................................................................... 4 • Changed VDO dropout voltage test conditions; deleted IOUT = 50 mA and IOUT = 100 mA with VOUT = 2.8 V test parameters ............................................................................................................................................................................. 5 • Deleted EVM Dissipation Ratings table ............................................................................................................................... 16 Changes from Revision A (October 2010) to Revision B Page • Added SON-6 (DSE) package and related references to data sheet..................................................................................... 1 2 Submit Documentation Feedback Copyright © 2010–2015, Texas Instruments Incorporated Product Folder Links: TLV702 |
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