MM5484 datasheet(2/4 Pages) NSC

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Absolute Maximum Ratings

If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Voltage at LED Outputs

VSS b 05V to VSS a 12V

Voltage at Other Pins

VSS b 05V to VSS a 10V

Operating Temperature

40 Cto a85 C

Storage Temperature

40 Cto a150 C

Power Dissipation at 25 C

Molded DIP Package board mount

Molded DIP Package socket mount

18W

Molded DIP Package board mount

iJA e 63 CW

derate 158m W C above 25 C

Molded DIP Package socket mount

iJA e 69 CW

derate 145m W C above 25 C

Lead Temperature (Soldering 10 sec)

300 C

DC Electrical Characteristics VDD e 45V to 9V TA eb40 Cto a85 C unless otherwise specified

Parameter

Conditions

Min

Typ

Max

Units

Supply Voltage

Supply Current

Logic One

Input High Level VIH

VDD a 05

Logic Zero

Input Low Level VIL

Input Current

High or Low Level

Input Capacitance

OUTPUTS

Data Output Voltage

High Level VOH

IOUT e 01 mA

VDD b 05

Low Level VOL

IOUT eb01 mA

Segment Off

VOUT e 12V

(Logic Zero on Input)

REXT e 400X

Output Current Segment On

(Logic One on Input)

IOUT e 15 mA

Output Voltage

VDD t 6V

AC Electrical Characteristics

(See

Figure 3 ) VDD e 45V to 9V TA eb40 Cto a85 C unless otherwise specified

Symbol

Parameter

Conditions

Min

Typ

Max

Units

Clock Frequency

MHz

High Time

095

Low Time

095

tS1

Data Setup Time

tH1

Data Hold Time

tS2

Enable Setup Time

tH2

Enable Hold Time

tpd

Data Out Delay

Note 1

Under no condition should the power dissipated by the segment driver exceed 50 mW nor the entire chip power dissipation exceed 500 mW

Note 2

AC input waveform specification for test purpose tr s 20 ns tf s 20 ns f e 500 kHz 50% g10% duty cycle

Note 3

Clock input rise and fall times must not exceed 500 ns

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