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STM32L151VB 数据表(PDF) 118 Page - STMicroelectronics |
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STM32L151VB 数据表(HTML) 118 Page - STMicroelectronics |
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118 / 133 page  Package information STM32L151x6/8/B STM32L152x6/8/B 118/133 DocID17659 Rev 12 Figure 45. UFBGA100 7 x 7 mm, 0.5 mm pitch, package recommended footprint eee - - 0.15 - - 0.0059 fff - - 0.05 - - 0.002 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 68. UFBGA100 7 x 7 mm, 0.5 mm pitch, recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Table 67. UFBGA100 7 x 7 mm, 0.5 mm pitch, package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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