STM32F411CEU6TR datasheet(82/149 Pages) STMICROELECTRONICS

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Electrical characteristics

STM32F411xC STM32F411xE

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DocID026289 Rev 6

6.3.8

External clock source characteristics

High-speed external user clock generated from an external source

In bypass mode the HSE oscillator is switched off and the input pin is a standard I/O. The

external clock signal has to respect the Table 53. However, the recommended clock input

waveform is shown in Figure 22.

The characteristics given in Table 35 result from tests performed using an high-speed

external clock source, and under ambient temperature and supply voltage conditions

summarized in Table 14.

Table 34. Low-power mode wakeup timings(1)

Symbol

Parameter

Min(1)

Typ(1)

Max(1)

Unit

tWUSLEEP(2)

Wakeup from Sleep mode

CPU

clock

cycle

tWUSTOP(2)

Wakeup from Stop mode, usage of main regulator

13.5

14.5

µs

Wakeup from Stop mode, usage of main regulator, Flash

memory in Deep power down mode

-105

111

Wakeup from Stop mode, regulator in low power mode

Wakeup from Stop mode, regulator in low power mode,

Flash memory in Deep power down mode

113

130

tWUSTDBY(2)(3)

Wakeup from Standby mode

314

407

µs

tWUFLASH

Wakeup of Flash from Flash_Stop mode

µs

Wakeup of Flash from Flash Deep power down mode

100

1. Guaranteed by characterization results.

2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction.

3. tWUSTDBY maximum value is given at –40 °C.

Table 35. High-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHSE_ext

External user clock source frequency(1)

MHz

VHSEH

OSC_IN input pin high level voltage

0.7VDD

-VDD

VHSEL

OSC_IN input pin low level voltage

VSS

-0.3VDD

tw(HSEH)

tw(HSEL)

OSC_IN high or low time(1)

tr(HSE)

tf(HSE)

OSC_IN rise or fall time(1)

Cin(HSE)

OSC_IN input capacitance(1)

DuCy(HSE) Duty cycle

OSC_IN Input leakage current

VSS ≤VIN ≤VDD

±1

µA

1. Guaranteed by design.

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