M24C64-RBN6P datasheet(25/26 Pages) STMICROELECTRONICS

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M24C64, M24C32

REVISION HISTORY

Table 23. Document Revision History

Date

Rev.

Description of Revision

22-Dec-1999

2.3

TSSOP8 package in place of TSSOP14 (pp 1, 2, OrderingInfo, PackageMechData).

28-Jun-2000

2.4

TSSOP8 package data corrected

31-Oct-2000

2.5

References to Temperature Range 3 removed from Ordering Information

Voltage range -S added, and range -R removed from text and tables throughout.

20-Apr-2001

2.6

Lead Soldering Temperature in the Absolute Maximum Ratings table amended

Write Cycle Polling Flow Chart using ACK illustration updated

References to PSDIP changed to PDIP and Package Mechanical data updated

16-Jan-2002

2.7

Test condition for ILI made more precise, and value of ILI for E2-E0 and WC added

-R voltage range added

02-Aug-2002

2.8

Document reformatted using new template.

TSSOP8 (3x3mm² body size) package (MSOP8) added.

5ms write time offered for 5V and 2.5V devices

04-Feb-2003

2.9

SO8W package removed. -S voltage range removed

27-May-2003

2.10

TSSOP8 (3x3mm² body size) package (MSOP8) removed

22-Oct-2003

3.0

Table of contents, and Pb-free options added. Minor wording changes in Summary

Description, Power-On Reset, Memory Addressing, Write Operations, Read Operations.

VIL(min) improved to -0.45V.

01-Jun-2004

4.0

Absolute Maximum Ratings for VIO(min) and VCC(min) improved. Soldering temperature

information clarified for RoHS compliant devices. Device Grade clarified

04-Nov-2004

5.0

Product List summary table added. Device Grade 3 added. 4.5-5.5V range is Not for New

Design. Some minor wording changes. AEC-Q100-002 compliance. tNS(max) changed.

VIL(min) is the same on all input pins of the device. ZWCL changed.

05-Jan-2005

6.0

UFDFPN8 package added. Small text changes.

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