Characteristics

STTH2L06-Y

4/8

DocID026715 Rev 1

Figure 7. Reverse recovery charges versus

Figure 8. Relative variation of dynamic

parameters versus junction temperature

QnC

0

100

200

300

400

500

600

700

800

0

100

200

300

400

500

dI /dt A/µ

F

(s)

V = 400 V

R

T = 125 °C

j

I = 2 x I (av)

FF

I = I (av)

FF

I = 0.5 x I (av)

FF

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

25

50

75

100

125

I = I (av)

FF

V = 400 V

R

Reference: T = 125 °C

j

T°C

j()

QRR

Figure 9. Transient peak forward voltage versus

(typical values)

VV

0

2

4

6

8

10

12

20

40

60

80

100

120

140

160

180

200

I= 2 A

F

T = 125 °C

j

dI /dt A/µ

F

(s)

tns)

0

20

40

60

80

100

20

40

60

80

100

120

140

160

180

200

dI /dt A/µ

F

(s)

I= 2 A

F

V

= 2.5 V

FR

T = 125 °C

j

Figure 11. Junction capacitance versus reverse

voltage applied (typical values)

Figure 12. Thermal resistance junction to

ambient versus copper surface under each lead

(typical values)

C pF)

(

1

10

100

1

10

100

1000

F = 1 MHz

V

= 30 mV

osc

RMS

T = 25 °C

j

Rth(j-a)(°C/W)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

SMBflat

S

(cm²)

cu

epoxy printed circuit board FR4, copper thickness: 35 µm