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STTH5R06DJF 数据表(PDF) 5 Page - STMicroelectronics |
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STTH5R06DJF 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 9 page ![]() STTH5R06DJF Characteristics Doc ID 022760 Rev 1 5/9 Figure 9. Transient peak forward voltage versus dI F/dt (typical values) Figure 10. Forward recovery time versus dI F/dt (typical values) Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab 0 1 2 3 4 5 6 0 50 100 150 200 250 300 350 400 450 500 V FP(V) IF=IF(AV) Tj=125 °C dIF/dt(A/µs) 0 10 20 30 40 50 60 70 80 90 100 110 50 100 150 200 250 300 350 400 450 500 t FR(ns) IF=IF(AV) VFR=1.6V Tj=125 °C dIF/dt(A/µs) 10 100 1000 1 10 100 1000 C(pF) F=1 MHz VOSC=30 mVRMS Tj=25 °C VR(V) 0 50 100 150 200 250 01 2345 6 78 9 10 PowerFLAT 5x6 Rth(j-a)(°C/W) Scu(cm2) epoxy printed circuit board Fr4 copper thickness = 35 µm |
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