Characteristics

BTA10, BTB10, T10xx

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DocID2937 Rev 7

Figure 7: Relative variation of gate trigger current,

holding current and latching current versus

junction temperature (typical values)

Figure 8: Relative variation of critical rate of

decrease of main current versus

(dV/dt)c (typical values)

Figure 9: Relative variation of critical rate of

decrease of main current versus junction

temperature

Figure 10: D2PAK thermal resistance junction to

ambient versus copper surface under tab

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(dl/dt)c [Tj] / (dl/dt)c [Tj = 125 °C]

Tj(°C)

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Epoxy printed board FR4, eCU= 35 µm