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STP16DPP05XTTR 数据表(PDF) 17 Page - STMicroelectronics |
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STP16DPP05XTTR 数据表(HTML) 17 Page - STMicroelectronics |
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17 / 34 page ![]() STP16DPP05 Typical characteristics DocID16518 Rev 4 17/34 Figure 15: Power dissipation vs package temperature The exposed pad should be soldered to the PCB to obtain the thermal benefits. Figure 16: Turn ON output current characteristics(1) Figure 17: Turn OFF output current characteristics(2) Notes: (1) The reference level for the TON characteristics is 50% of OE/DM2 signal and 90 % of output current. (2) The reference level for the TOFF characteristics is 50% of OE/DM2 signal and 10 % of output current. Electrical conditions: Vdd = 3.3 V, Vin = Vdd, Vled = 3.0 V, RL = 60 Ω, CL = 10 pF Ch1 (Yellow) = OE/DM2 , Ch2 (Blue) = SDI, Ch3 (Purple) = VOUT, Ch4 (Green) = OUT |
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